NITS, under the Ministry of Trade, Industry, and Energy, is hosting a five-day meeting for the IEC/TC 91 on Electronic Assembly Technology Standardization with participation from over 50 experts from nine member countries, including the United States, Germany, Japan, and China. The meeting is being held at the Ocean Suites Hotel in Jeju from November 6 to 10.
The ongoing international conference is discussing South Korea's 'Cavity Substrate Design Technology,' a critical standard related to downsizing semiconductor packages, which is in its final approval stage for international standardization.
The proposed international standard addresses 'Laser Bonding Technology' for joining electronic components and printed circuit boards.
Laser bonding technology, designed to reduce warpage and energy loss in substrates, is the focus of a proposed international standard. Its development will continue with approval required from over two-thirds of the participating member countries in the relevant technical committee.
If you have any inquiries or need information regarding testing and certification of electrical and electronic products in Korea, please contact GCA KOREA.
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